Missions
Semiconductors & New Electronics
Engineering-led mission in Shenzhen / GBA
SemiconductorsElectronicsFactory audit
Outcomes
- Shortlist of vetted suppliers and engineering contacts
- On-site notes and risk register
- Negotiation support and next-step plan
Included / Excluded
Included
- Curated meetings
- On-site visits
- Interpretation and negotiation support
Excluded
- Flights and accommodation
Overview
An engineering-led mission for teams sourcing semiconductors, PCBA services, packaging, and test from China’s electronics hub. We combine deep chip-architecture knowledge with on-the-ground supplier access to help you evaluate vendors, audit processes, and negotiate from a position of technical credibility.
Who this is for
- Hardware engineering teams evaluating Chinese IC vendors or alternate components
- Companies seeking PCBA/EMS partners for complex boards
- R&D teams exploring chip packaging, test, or wafer-level services in GBA
- Procurement leads benchmarking Chinese suppliers against existing sources
Prerequisites (what you provide)
- Target component categories, package types, or BOM sections
- Volume and quality tier expectations
- IP sensitivity and NDA requirements
Itinerary
- Day 1: Technical briefing + GBA semiconductor landscape overview + requirements alignment
- Day 2: IC vendor or distributor meetings + engineering Q&A on process nodes, yield, and test
- Day 3: PCBA/EMS factory visit + audit (DFM, quality system, traceability)
- Day 4: Packaging or test house visit + alternate supplier comparison + negotiation
- Day 5: Decision package assembly + risk register review + next-step plan
Ready to tailor this mission to your goals?
Tell us your industry, objectives, and dates — we'll propose a concrete plan.